◈ Company Information

Cretek, Inc. located in Nyonhyun-dong, Kangnam-Gu, Seoul has established in 1999 by staff who had been experiencing in semiconductor assembly field.  We are representing Royce Instruments (Bond Tester, USA), Diemat Inc.(Thermally Conductive Adhesive, USA), Orthodyne Electronics (Aluminum Wedge Bonder, USA) and Ismeca Semiconductor (Test Handler, Switzerland) for Korean market, so that we can possibly provide synthetic solution for semiconductor assembly field.

◈Products

1. Royce 650 (Bond Tester) : Wire & Ball Pull, Ball & Die Shear, Stud Pull, Die shear of Maximum 200kg, Hardness Test for Weak & Sensitive Dies,  High Accuracy (+/-0.15% of Test Modules), Max.35um Ultra Fine Pitch, Variety and accurate measurement for test object by integrated vision system, Convenient operation with Built in standard windows XP PC

▶Homepage of Royce Instruments : http://www.royceinstruments.com

2. High Thermally Conductive Adhesives & Low Temperature Sealing Glasses :

Ag Epoxy Series by Diemat, USA which have high thermal conductivity (12W/m’K ~ 70W/m’K) and special features.  The series is optimized for High-Power Die Attach, High-Brightness LED, MCM, COB and Automotive.  We also provide more sort of epoxies such as Insulating Adhesives and Low-Temperature Hermetic Sealing Glass for other variety applications and usage such as Fiber Optic.

▶Homepage of Diemat, Inc. : http://www.diemat.com

◈Contact

Byoung Hun, Kim

E-mail : bhlee@cretek.com

Tel : 82-2-511-9271

Website : www.cretek.com